Wafer map analysis

Spatial failure patterns traced to the tool

SemiconductorsAnalysisQualitySnowflake, Databricks, Tableau
How a run goes
The steps this agent takes, in order, and what each one leaves behind.
Pulls probe maps and lot processing history

Classifies wafer maps by spatial signature such as edge, center, scratch and repeating patterns

Clusters the maps and joins clusters to tool routes

Traces each signature to the tools and chambers the affected lots shared

Drafts the finding with the suspect step ranked first

Produces an evidence pack for the process engineer with the wafers and the suspect step

Works inSnowflake, Databricks, Tableau

What it does

  • Classifies wafer maps by spatial signature such as edge, center, scratch and repeating patterns
  • Traces each signature to the tools and chambers the affected lots shared
  • Produces an evidence pack for the process engineer with the wafers and the suspect step

Connects to

Skills included

  • Signature classification
  • Tool commonality

Need it to work differently?

Every agent can be changed: the steps it takes, the systems it uses and who approves what.